Overview
About This Application
Diamond-reinforced metal matrix composites (diamond/Cu, diamond/Al) combine the highest thermal conductivity of diamond with the processability of metals. They are the leading heat-spreading solution for high-power electronics.
Application Areas
- High-power semiconductor laser heat sinks.
- RF power amplifier heat-dissipation substrates (5G base stations).
- AI chip cooling assemblies.
- EV power electronics IGBT modules.
- Aerospace high-density electronics thermal structures.
Recommended Grades
- T (Ti-coated) - coating improves interface bonding in the metal matrix.
- HDY monocrystalline micron - controlled particle size for composite fabrication (1-100 um typical).
Selection Notes
Particle size, distribution and surface coating control the composite thermal performance. Ti-coated diamond is preferred where strong metal-diamond interface bonding is required.
Recommended Products
Diamond Grades For This Process
Company Strength
Factory Direct Since 1990
Zhecheng Hongxiang Superhard Material Co., Ltd. is an integrated manufacturer and exporter of synthetic diamond powders since 1990, located in the Diamond Capital of China.
30+Years in Business
124,000 m²Factory Area
240 T/YPowder Capacity
100%Batch PSD Tested
Inquiry
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