Application Hub · Grade Selection
Thermal Management
Diamond fillers and preforms for chip, power-module and laser cooling.
Sub Applications
Solutions In This Category
Diamond has the highest thermal conductivity of any bulk material, which makes it the filler of choice for heat spreaders, thermal interface materials and metal-matrix composites. Performance is governed by purity, particle morphology and dispersion rather than by particle size alone.
Diamond Powder For Thermal Interface MaterialsMicron diamond fillers for thermal gels, greases and gap pads — high loading, low viscosity, nickel or titanium...
Diamond Powder For 3D Printing And Metal Matrix CompositesTitanium-coated and MBD series grit for diamond–copper and diamond–SiC composites made by additive manufacturing, infiltration or sintering.
Diamond Powder For Thermal ManagementTi-coated and high-purity diamond powder for heat sinks, diamond-SiC composites and thermal interface materials.
Diamond Grades For This Category
| Process step | Grade direction | Size range |
|---|---|---|
| Diamond–Cu / diamond–SiC heat sinks | Monocrystalline, Ti-coated for wetting | 4–8, 8–16, 10–20, 30–40 µm |
| Thermal interface materials (TIM) | Micron powder, multi-modal blends | 0.5, 1 µm and 1–100 µm blends |
| Metal-matrix composites / 3D printing | Ti-coated HDY, coarse grit | 30–40, 36–54, 40–60 mesh |
| High-power laser & IGBT cooling | Monocrystalline, low metal content | 36–54, 80/100 mesh |
Selection Notes
How To Choose The Right Grade
- Ask for oxygen and metal-ion content first — thermal conductivity drops quickly with impurities at the grain boundary.
- Ti-coated grades are normally required for copper and aluminium matrices to secure wetting.
- For TIM formulations, a multi-modal blend usually outperforms any single narrow PSD.
Inquiry
What To Include
Start from the application requirement. We will help narrow the grade, particle size and packing route.
1Matrix material (Cu / Al / SiC / polymer)
2Target thermal conductivity (W/m·K)
3Coating requirement (Ti / Ni / none)
4Processing route (sintering / infiltration / 3D printing)