SiC and sapphire are hard brittle materials, so diamond powder selection must consider removal rate, subsurface damage and final scratch control.
Why Fine Control Matters
A narrow and stable particle-size distribution helps reduce unpredictable scratches and keeps the process easier to repeat between batches.
- Controlled PSD
- Clean washing and drying
- Consistent morphology
Typical Grade Direction
Polycrystalline and fine monocrystalline routes are commonly compared during trial testing.
- HDYP for fine finishing behavior
- HDP for polycrystalline route testing
- HDYM or HDPN for ultra-fine requirements
What To Send With The Inquiry
Share the wafer material, current abrasive, target finish, equipment and trial quantity so the supplier can recommend a practical starting grade.