Buyer Problem
What This Process Needs To Solve
Silicon carbide and sapphire substrates demand damage-free, high-precision polishing. Polycrystalline and nano grades deliver low surface roughness with minimal scratches, key for LEDs, power electronics and optical windows.
Recommended Grades
- HDYP polycrystalline (0.7-40 um) - the main grade for lapping and rough polishing.
- HDP / HDPN detonation polycrystalline and nano (5 nm-500 nm) - final scratch-free polishing.
- HDY monocrystalline - pre-polishing steps where higher removal is needed.
Selection Notes
Polycrystalline grades reduce deep scratches because their small cutting edges remove material evenly. Progress from coarse poly to nano poly for the final mirror finish.
Grade Direction
Diamond Grades For This Process
HDY Monocrystalline Diamond Micron PowderW50 - W1
HDYP Polycrystalline Diamond Micron Powder0.7 - 40 um
HDP Detonation Polycrystalline Diamond Powder0-1 to 1-8 um (per factory table: 0-1~1/8)
HDPN Nano Detonation Polycrystalline Diamond5 nm - 500 nm
HDN Nano Monocrystalline Diamond Micron PowderNano (confirm)
Company Strength
Factory Direct Since 1990
Zhecheng Hongxiang Superhard Material Co., Ltd. is an integrated manufacturer and exporter of synthetic diamond powders since 1990, located in the Diamond Capital of China.
- Own manufacturing base in Zhengzhou, Henan — powder, coating and grading on one site.
- In-house particle size and SEM inspection on every batch before packing.
- Export packing with neutral or custom label, plus sample quantities for process trials.
30+Years in Business
124,000 sqmFactory Area
240 T/YPowder Capacity
100%Batch PSD Tested
Inquiry
What To Include
Describe your workpiece, process and target result. We will match the diamond grade from the existing product range.
1Workpiece and operationGlass, SiC, sapphire, carbide or ceramic / lapping, polishing, grinding or cutting.
2Target resultSurface finish, removal rate, scratch control, tool life or holding-force problem.
3Trial orderSample size, destination country, expected quantity and packing requirement.