Diamond Wire Sawing of Silicon & Sapphire

Diamond wire sawing is the dominant method for slicing silicon wafers (photovoltaic and semiconductor) and sapphire ingots. The diamond powder is embedded or coated onto the wire to cut through hard, brittle materials with low kerf loss and high throughput.

Recommended Grades

• HDY monocrystalline micron powder - resin-bonded diamond wire, grades from 0-0.25 to 40-60 um (typical 800#-3000#).
• MBD / Ni-coated MBD high-strength grit - metal-bonded diamond wire, 180#-2000#.
• N (Ni-coated HDY-N) - improved retention for electroplated wire.

Selection Notes

Choose finer grades for final slicing of thinner wafers and coarser grades for higher removal rate. Consistent PSD and high particle strength are critical for wire life and cut quality.