Buyer Problem
What This Process Needs To Solve
Diamond wire sawing is the dominant method for slicing silicon wafers (photovoltaic and semiconductor) and sapphire ingots. The diamond powder is embedded or coated onto the wire to cut through hard, brittle materials with low kerf loss and high throughput.
Recommended Grades
- HDY monocrystalline micron powder - resin-bonded diamond wire, grades from 0-0.25 to 40-60 um (typical 800#-3000#).
- MBD / Ni-coated MBD high-strength grit - metal-bonded diamond wire, 180#-2000#.
- N (Ni-coated HDY-N) - improved retention for electroplated wire.
Selection Notes
Choose finer grades for final slicing of thinner wafers and coarser grades for higher removal rate. Consistent PSD and high particle strength are critical for wire life and cut quality.
Grade Direction
Diamond Grades For This Process
Company Strength
Factory Direct Since 1990
Zhecheng Hongxiang Superhard Material Co., Ltd. is an integrated manufacturer and exporter of synthetic diamond powders since 1990, located in the Diamond Capital of China.
- Own manufacturing base in Zhengzhou, Henan — powder, coating and grading on one site.
- In-house particle size and SEM inspection on every batch before packing.
- Export packing with neutral or custom label, plus sample quantities for process trials.
30+Years in Business
124,000 sqmFactory Area
240 T/YPowder Capacity
100%Batch PSD Tested
Inquiry
What To Include
Describe your workpiece, process and target result. We will match the diamond grade from the existing product range.
1Workpiece and operationGlass, SiC, sapphire, carbide or ceramic / lapping, polishing, grinding or cutting.
2Target resultSurface finish, removal rate, scratch control, tool life or holding-force problem.
3Trial orderSample size, destination country, expected quantity and packing requirement.