Process Guides

By process and application - polishing, lapping, grinding, cutting, tool making

In this topic

8 Guides To Read

Lapping and polishing use the same powder families but different process logic. How to pick a size ladder, a plate and a carrier for each.

Solids loading, carrier, viscosity and stability decide whether a slurry works. The specification items that are not on the powder datasheet.

Cemented carbide fails on cobalt smearing; technical ceramics fail on subsurface damage. Why the same powder does not solve both.

Size ladders, crystal choice and slurry behaviour for optical glass polishing, plus the four checks that stop a trial from producing scratches.

What changes when the workpiece is a wafer: purity, PSD tails, slurry stability and the grade ladder from 0.5 to 60 micrometres.

What nickel and titanium coatings actually do in each bond system, the weight gains involved, and how to tell a good coating from a patchy one.

Mesh range, toughness, coating and concentration for stone cutting and concrete drilling, with the failure patterns that point to each variable.

Diamond as a filler rather than an abrasive: coating choice, size grading and the interface problems that decide whether a composite conducts heat.

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