◆ Manufacturer since 1990◆ Block A, 5th Research Institution, Zhengzhou, Henan, China
HNHONGXIANG
HNHONGXIANGSuperhard Materials
Specialty & Emerging Materials

Diamond Powder For CVD And Composite Coatings

CVD seeding, electroplating, polymer composite coating, spray coating / Materials: Cemented carbide substrates, ceramics, polymer and nickel matrices
Process: CVD seeding, electroplating, polymer composite coating, spray coating Materials: Cemented carbide substrates, ceramics, polymer and nickel matrices Industries: Cutting tools, forming and drawing dies, moulds, wear-resistant components
Buyer Problem

What This Process Needs To Solve

In a coating, diamond is bought for what it does inside the layer rather than what it removes from a surface. Two routes use our powder: seeding, where a fine diamond suspension is applied to a substrate so that CVD growth starts from a dense nucleation layer, and composite reinforcement, where diamond particles are dispersed in a polymer or electroplated matrix to raise wear resistance.

Seeding wants the finest fraction

Nucleation density sets the final coating’s grain size and adhesion. A dense, evenly spread seed layer of very fine uniform diamond produces a fine-grained, well-adhered film; a patchy or agglomerated seed layer produces a coarse, poorly bonded one. Fine micron powder that disperses cleanly and contains no agglomerates is what the process needs.

Composite coatings want surface activity

Where diamond is dispersed into a polymer or a plating bath to make a wear-resistant composite, the particle’s surface chemistry and dispersion decide the result long before the particle size does. We supply grades with treated surfaces where wetting is the problem, and we can specify the size window against a target coating thickness.

Grade Direction

Recommended Grades And Size Ranges

Coating grades are quoted against a target layer thickness and a target nucleation density.

UseRecommended gradeSize rangeWhy this grade
CVD seedingHard-metal and ceramic substrates
Nucleation seedingHDYM fine micron, well dispersed0.5 – 2 µmHigh nucleation density, even seed layer
Monolayer seedingHDY monocrystalline micron2 – 6 µmUniform coverage on rougher substrates
Composite and functional coatingsPolymer, nickel and composite systems
Wear-resistant polymer coatingHDY monocrystalline micron, treated surface1 – 3, 5 – 10 µmTreated surface wets the resin
Nickel–diamond compositeHDY monocrystalline micron2 – 10 µmCo-deposits evenly in the plating bath
Thick composite layerHDY monocrystalline micron10 – 40 µmBuilds layer thickness without cracking

Surface treatment is available where wetting is the limiting factor, and purity is reported on the batch certificate.

What has to hold

  • Uniform size with no agglomerates
  • High purity and a clean surface
  • Good dispersion in the carrier
  • Surface treatment for polymer and plating systems
  • Consistent behaviour batch to batch

Where it ships

United StatesGermanyJapan
Company Strength

Factory Direct Since 1990

Zhecheng Hongxiang Superhard Material Co., Ltd. is an integrated manufacturer and exporter of synthetic diamond powders since 1990, located in the Diamond Capital of China.

  • Own manufacturing base in Zhengzhou, Henan — powder, coating and grading on one site.
  • In-house particle size and SEM inspection on every batch before packing.
  • Export packing with neutral or custom label, plus sample quantities for process trials.
30+Years in Business
124,000 sqmFactory Area
240 T/YPowder Capacity
100%Batch PSD Tested
HNHONGXIANG factory gate, Zhengzhou, Henan HNHONGXIANG plant aerial view
Inquiry

What To Include

Describe your workpiece, process and target result. We will match the diamond grade from the existing product range.

1Workpiece and operationCemented carbide substrates, ceramics, polymer and nickel matrices / CVD seeding, electroplating, polymer composite coating, spray coating.
2Target resultSurface finish, removal rate, scratch control, tool life or holding-force problem.
3Trial orderSample size, destination country, expected quantity and packing requirement.

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