HDYP Polycrystalline Diamond Micron Powder
HDYP Series / Grain size 0.7 - 40 um / Polycrystalline
HDYP Polycrystalline Diamond Micron Powder
HDYP Polycrystalline Diamond Micron Powder is a polycrystalline grade from the HDYP series, produced factory-direct at our own base in Zhengzhou, Henan - the Diamond Capital of China. Standard grain size range: 0.7 - 40 um. Each batch is checked for particle size distribution before packing, and can be supplied in trial quantities for process validation.
Advantage
- Polycrystalline structure with many small cutting edges per particle
- Removal rate 1 to 2 times that of monocrystalline powder of the same size
- Shallower scratch depth — surface Ra is significantly lower after polishing
- Porous, rough particle surface holds slurry and helps heat escape
- Narrow particle size distribution, so the batch behaves predictably
- Ships in 1 to 2 working days from stock
Send your workpiece material, target surface finish and order quantity — we confirm the matching grade and sample route within 24 hours.
Product Overview
HDYP Polycrystalline Diamond Micron Powder is our quasi-polycrystalline micron grade, and the grade most often specified for wafer polishing. Each particle carries a polycrystalline structure with a porous surface covered in many small cutting edges rather than one large edge.
That structure is the whole point. Material removal rate is high because there are many edges working at once, and the resulting scratch is shallower than a monocrystalline particle of the same size would leave, because no single edge is big enough to cut deep.
Supplied from 0.7 µm to 40 µm. Use HDYP for sapphire, SiC and ceramic wafer polishing slurry, for hardening-steel and aluminium finishing, and anywhere the process is limited by surface finish rather than by how fast the material comes off.
Standard Grain Size Chart
Quasi-polycrystalline micron powder is sold on the micron band rather than on the settling ladder, because the porous particle surface and the agglomerate structure mean the useful measure is the size window the customer screens against. The band runs 0.7 µm to 40 µm.
| GradeSize band | Size range (µm)Micron window | MeshSieve no. | Typical use |
|---|---|---|---|
| Fine micron0.7 – 4 µmFinal polishing where scratch depth drives the specification | |||
| 0.7 – 1 | 0.7 – 1 | 15,000 | Mirror to precision polishing |
| 1 – 2 | 1 – 2 | 12,000 | Precision polishing |
| 2 – 4 | 2 – 4 | 6,500 | Precision polishing |
| Medium micron4 – 20 µmGeneral polishing and lapping | |||
| 4 – 8 | 4 – 8 | 3,000 | General polishing |
| 8 – 12 | 8 – 12 | 1,600 | General polishing |
| 8 – 16 | 8 – 16 | 1,300 | General polishing |
| 10 – 20 | 10 – 20 | 1,200 | Lapping |
| Coarse micron20 – 40 µmStock removal and pre-polish | |||
| 20 – 30 | 20 – 30 | 700 | Lapping |
| 20 – 40 | 20 – 40 | 500 | Coarse lapping |
| 30 – 40 | 30 – 40 | 450 | Coarse lapping |
Supplied from 0.7 µm to 40 µm. Bands outside that window are produced against a customer sample rather than from stock. D50 and the upper cut are reported on the batch certificate.
Recommended Applications
Factory Checks Behind This Grade
HNHONGXIANG has produced synthetic diamond powder since 1990 in Henan, China. The factory covers about 124,000 square meters and supplies micron powder, diamond grit, coated diamond and functional diamond materials for global abrasive and precision processing customers.
Batch particle-size inspection
Laser diffraction PSD checked before packing, for stable batch-to-batch performance.
Factory-direct processing
Grading, washing, drying and packing handled in our own plant.
Custom grades available
Grade selection and private-label packaging to your specification.
Export support
Samples, trial orders and bulk shipments with full batch documents.
Packing And Export Options
Standard packing includes sealed bottles, bags or drums according to particle size and order quantity. Inner packaging is moisture-resistant and clearly labeled with product model, grain size, batch number and net weight.
Multiple package options
Sample, kilogram and bulk orders.
Moisture-resistant packing
Sealed bottles, bags or drums.
Clear labeling
Model, grain size, batch no. and net weight.
Export ready
Cartons or drums for air, express or sea.
Bottle package
50 / 100 / 150 / 200 / 300 / 500 / 1000 / 2000 / 3000 / 5000 / 10000 ct
Bag package
100 ct – 10000 ct sealed foil bags, labelled per batch.
Shipping methods
Air, express or sea freight according to order quantity.
Where HDYP Sits In The Polycrystalline Range
Polycrystalline diamond powder carries many small cutting edges on each particle instead of one large edge. The result is a higher removal rate with a shallower scratch, which is why it dominates sapphire, SiC and wafer polishing. The table shows how the poly grades compare.
| Grade | Type | Production route | Size range | Cutting behaviour | Typical applications |
|---|---|---|---|---|---|
| HDYPThis grade | Quasi-polycrystalline micron | Cost-reduced polycrystalline route | 1 — 50 µm | Many small edges per particle; high removal without deep scratches | Sapphire, SiC and ceramic wafer polishing slurry; metal finishing |
| HDP | Detonation polycrystalline | Detonation synthesis | 1 — 40 µm | Multi-layered particles with extra crystal edges; coarse grains break down to expose fresh edges | Sapphire, engineering ceramic and optical glass substrates |
| HDPN | Nano detonation polycrystalline | Detonation synthesis (nano) | 5 — 500 nm | Nano-scale particles with very high specific surface area | Diamond coating, nano polishing, composite reinforcement, thermal management |
| HDRP | Resin-bond polycrystalline | Polycrystalline, selected for resin systems | 0 — 40 µm | Friable structure tuned for resin-bond retention | Resin-bond wheels, lapping and polishing compounds |
What To Include
Send the current product, particle size target and process problem. We will confirm the matching grade, sample route and packing option.