HDRP Resin-Bond Polycrystalline Diamond Powder
HDRP Series / Grain size 0-2 to 40 um / Polycrystalline
HDRP Resin-Bond Polycrystalline Diamond Powder
HDRP Resin-Bond Polycrystalline Diamond Powder is a polycrystalline grade from the HDRP series, produced factory-direct at our own base in Zhengzhou, Henan - the Diamond Capital of China. Standard grain size range: 0-2 to 40 um. Each batch is checked for particle size distribution before packing, and can be supplied in trial quantities for process validation.
Advantage
- Polycrystalline structure selected specifically for resin-bond retention
- Controlled micro-fracture exposes new edges instead of glazing
- Keeps a wheel cutting between dressings
- Narrow PSD for predictable stock removal
- 0 to 40 µm range available
- Ships in 1 to 2 working days from stock
Send your workpiece material, target surface finish and order quantity — we confirm the matching grade and sample route within 24 hours.
Product Overview
HDRP Resin-Bond Polycrystalline Diamond is selected for resin-bond systems specifically. The polycrystalline structure is friable in a controlled way: the particle micro-fractures to expose new cutting edges instead of either polishing smoothly away or pulling out of the bond.
In a resin bond that behaviour is what keeps a wheel cutting between dressings, and it is the reason the grade is chosen over a monocrystalline powder when glazing and loading are the failure mode.
Typical use is resin-bond diamond wheels, lapping and polishing compounds and finishing tools on hard and brittle materials.
Standard Grain Size Chart
Resin-bond polycrystalline powder is graded on the micron band so the bond formulator can match it directly to the filler loading and the cure cycle. The band runs 0 to 40 µm, with the cuts below listed as the standard ladder.
| GradeSize band | Size range (µm)Micron window | MeshSieve no. | Typical use |
|---|---|---|---|
| Fine micron0 – 4 µmFinishing and compound work | |||
| 0 – 1 | 0 – 1 | 15,000 | Mirror polishing compound |
| 1 – 2 | 1 – 2 | 12,000 | Precision polishing |
| 2 – 4 | 2 – 4 | 6,500 | Precision polishing |
| Medium micron4 – 20 µmResin-bond wheel feed | |||
| 4 – 8 | 4 – 8 | 3,000 | Wheel and compound |
| 8 – 16 | 8 – 16 | 1,300 | Wheel feed |
| 10 – 20 | 10 – 20 | 1,200 | Wheel feed |
| Coarse micron20 – 40 µmHeavier stock removal in a resin bond | |||
| 20 – 30 | 20 – 30 | 700 | Stock removal |
| 20 – 40 | 20 – 40 | 500 | Stock removal |
Supplied from 0 to 40 µm. The grade is selected for resin-bond retention specifically — tell us the bond system and the loading and we will confirm the cut.
Recommended Applications
Factory Checks Behind This Grade
HNHONGXIANG has produced synthetic diamond powder since 1990 in Henan, China. The factory covers about 124,000 square meters and supplies micron powder, diamond grit, coated diamond and functional diamond materials for global abrasive and precision processing customers.
Batch particle-size inspection
Laser diffraction PSD checked before packing, for stable batch-to-batch performance.
Factory-direct processing
Grading, washing, drying and packing handled in our own plant.
Custom grades available
Grade selection and private-label packaging to your specification.
Export support
Samples, trial orders and bulk shipments with full batch documents.
Packing And Export Options
Standard packing includes sealed bottles, bags or drums according to particle size and order quantity. Inner packaging is moisture-resistant and clearly labeled with product model, grain size, batch number and net weight.
Multiple package options
Sample, kilogram and bulk orders.
Moisture-resistant packing
Sealed bottles, bags or drums.
Clear labeling
Model, grain size, batch no. and net weight.
Export ready
Cartons or drums for air, express or sea.
Bottle package
50 / 100 / 150 / 200 / 300 / 500 / 1000 / 2000 / 3000 / 5000 / 10000 ct
Bag package
100 ct – 10000 ct sealed foil bags, labelled per batch.
Shipping methods
Air, express or sea freight according to order quantity.
Where HDRP Sits In The Polycrystalline Range
Polycrystalline diamond powder carries many small cutting edges on each particle instead of one large edge. The result is a higher removal rate with a shallower scratch, which is why it dominates sapphire, SiC and wafer polishing. The table shows how the poly grades compare.
| Grade | Type | Production route | Size range | Cutting behaviour | Typical applications |
|---|---|---|---|---|---|
| HDYP | Quasi-polycrystalline micron | Cost-reduced polycrystalline route | 1 — 50 µm | Many small edges per particle; high removal without deep scratches | Sapphire, SiC and ceramic wafer polishing slurry; metal finishing |
| HDP | Detonation polycrystalline | Detonation synthesis | 1 — 40 µm | Multi-layered particles with extra crystal edges; coarse grains break down to expose fresh edges | Sapphire, engineering ceramic and optical glass substrates |
| HDPN | Nano detonation polycrystalline | Detonation synthesis (nano) | 5 — 500 nm | Nano-scale particles with very high specific surface area | Diamond coating, nano polishing, composite reinforcement, thermal management |
| HDRPThis grade | Resin-bond polycrystalline | Polycrystalline, selected for resin systems | 0 — 40 µm | Friable structure tuned for resin-bond retention | Resin-bond wheels, lapping and polishing compounds |
What To Include
Send the current product, particle size target and process problem. We will confirm the matching grade, sample route and packing option.